This furnace is suitable for medium-temperature heat treatment of electronic products, including nitrogen/hydrogen atmosphere heat treatment for electronic ceramics, media, and conductors.

• Model Number: HWF100-10NH
• Tank Dimensions: 630 × 900 (d × D)
• Effective Furnace Chamber Dimensions: 400 × 400 × 650 mm (W × H × D)
• Maximum Operating Temperature: 1000°C
• Long-term Working Temperature: 900°C
• Heating Method: FEC ceramic fiber heater
• Refractory Thermal Insulation: Alumina products
• Cooling Method: In-furnace cooling
• Temperature Control Points: Three independent points (front, middle, rear)
• Temperature Control Instrument: Japanese YAMATA intelligent temperature controller
• Number of Program Segments: 9
• Operating Power Supply: 380±10%V, 3-phase 5-wire, 50Hz
• Maximum Power: 30kW
• Thermal Insulation Power: ≤15kW

• Environmental Conditions: temp.: 0~40ºC, humidity ≤ 80%RH, no corrosive gas, no strong airflow disturbance
• N2 Conditions: 99.999% purity, working pressure: 0.2-0.4MPa, Max gas consumption 2-6 m³/h
• H2 Conditions: working pressure: 0.2-0.4MPa, Max gas consumption 0.2-0.6m³/h
• Water Conditions: clean, no corrosive water, working pressure 0.1-0.3MPa, 1-3L/min
• Ventilation System: non-contact access to user pumping system, capacity > 10m³/h
• Ground Requirements: horizontal, no vibration, load-bearing > 500 kg/m²
• Power Condition: capacity > 40kVA, 3-phase 5-line, voltage 220/380V, frequency 50Hz
• Installation Site: 3200mm×2500mm×3000mm(D×W×H), area > 8m²

Hefei Chitherm Equipment Co., Ltd. is an advanced equipment supplier specializing in the research and development, design, manufacturing, sales, maintenance, and service of high-, medium-, and low-temperature industrial furnaces and laboratory furnaces. Its product range encompasses bell furnaces, box furnaces, hot air furnaces, vacuum furnaces, tube furnaces, mesh belt furnaces, bogie hearth furnaces, rotary furnaces, roller hearth furnaces, and pusher furnaces, which are extensively applied in fields such as advanced ceramics, electronic components, thick-film circuits, additive manufacturing, powder metallurgy, new energy, and photovoltaics.